Directed self-assembly of mesoscopic dies using magnetic force and shape recognition

This paper reports on a directed self-assembly approach suitable for assembly of mesoscopic dies, such as LEDs, in a parallel fashion. This approach utilizes magnetic force, shape recognition, and capillary force of the solder to assemble the dies on the receiving substrate in a correct orientation. Assembly takes place in liquid medium. Effects of the die geometry, assembly setup and magnet configuration on the assembly results are presented along with the simulation of the solder-assisted self-alignment.