GlidCop(R) AL-25 first wall plates-IG1 grade compared to IG0 grade

GlidCop(R) (copper that is dispersion strengthened with aluminum oxide) is a primary candidate for ITER applications requiring copper alloys, including first wall and divertor components. The GlidCop AL-25 IG0 grade process and specification was developed to define the base properties for GlidCop plates made in the size range required for first wall modules. IG0 defines a process to make plates that are declad and annealed at 1000/spl deg/C to simulate the assembly conditions for fabrication of first wall modules. The GlidCop IG1 process is a variant of the IG0 process. It was developed for the long term commercial supply of plates for the first wall. The production sequence for IG1 plates is the same as IG0 plates, except IG1 plates are supplied clad and not annealed. The copper cladding is left on the IG1 plates to protect the core GlidCop material from oxidation and damage during rolling and handling. Annealing is eliminated because the IG1 plates will experience temperatures in the 1000/spl deg/C range during HIP assembly, thus annealing will take place during assembly. GlidCop IG1 plates have been produced and tested by OMG. Properties of IG1 plates are compared to the current GlidCop IG0 properties database.