Low-field TDDB reliability data to enable accurate lifetime predictions

A 30 month module-based low-field TDDB study of 90nm pitch Back End of the Line (BEOL) interconnect structures and a 9 month study of 80nm pitch BEOL structures have shown that the commonly used root-E extrapolation model is overly conservative at predicting TDDB lifetimes at low applied fields. A less conservative acceleration model is required to make accurate lifetime predictions at low fields.