Aluminium nitride metallized ceramic substrate performance

The authors demonstrate the feasibility of using aluminium nitride (AlN) as a substrate material for metallized ceramic modules, the ability to use standard thin-film metallization processes with AlN ceramics, and the improved thermal performance predicted for AlN modules. It is also shown that AlN modules can provide cost savings compared to alumina modules with internal thermal enhancement. The benefits of aluminium nitride may extend beyond the elimination of thermal enhancement and extension of solder bump fatigue life. One possibility is elimination of restrictions on the size of the chip footprint. Other applications are found in packages with wirebonded or tape automated bonding (TAB) attached chips, in which grease or radial finger contact (RFC) is not practical.<>