Measurement uncertainty characterization of terahertz large wafer probing

This paper introduces the characterization of the measurement uncertainty of large wafer probing in the WR-1.5 (500 GHz - 750 GHz) band. A micromachined WR-1.5 probe with integrated strain sensor is used to measure calibration standard sets at different locations on a 2-inch wafer. Measurement results of the strain sensor assisted WR-1.5 probe using 20 mN contract force are presented. As a comparison, measurement results of the WR-1.5 probe using fixed z-travel and corrected z-travel by z-profiling function provided by the probe station are also presented. Factors that contribute to measurement uncertainty are discussed. In addition, the recommended procedure for terahertz probing without an integrated strain sensor is provided.