Robustness validation in qualification activities of integrated circuits for automotive industry

Robustness validation results aimed at achieving lower ppm-failure rates by ensuring adequate guard band between the “real life” operation range of devices and the points at which device fails are presented. One of the main attentions was paid to package reliability (especially to bonding system reliability as major limitation factor) with combination of used different Bill of Material (BOM), different wafer technologies and different products.