Breakthrough into the third dimension - Sintered multi layer flex for ultra low inductance power modules

Power module packaging currently undergoes severe changes. Enhanced packaging technologies, such as silver diffusion sintering, transient liquid phase bonding, new bond wire materials and flex foil die attachment (SKiN(exp ®) Technology) have been introduced. These new technologies are driven by the need for higher power density, improved reliability and lower cost. For the utilization of wide bandgap switching devices the need for ultra low inductance packages becomes equally important. The two layer flex of the SKiN(exp ®) die attachment enables new possibilities of power track routing in power module design, leading to a significant reduction in commutation inductance. This paper presents the new packaging concept and its advantages leading to a 50% power density increase and a 60% reduction of the inner commutation inductance over the original, already optimized design.