Power Supply with Integrated PassivEs - The EU FP7 PowerSwipe Project

Combining high efficiency with cost-effective but high level of integration is a major driver in power electronics today. The EU FP7 PowerSwipe consortium proposes to develop next generation Power Supply in Package (PwrSiP) and Power Supply on Chip (PwrSoC) technology platforms through innovations in integrated power passives, nanoCMOS technologies and advanced packaging. This work focusses on the development of a full supply-chain for integrated power management technology including the first integrated system-level design tool for System on Chip (SoC) applications; high-volume MEMS manufacturing processes for monolithic power passives and 3D, embedded, wafer-level packaging technology to achieve a highly integrated SoC solution for automotive applications.