Packaging and Reliability of Power Modules

Power cycling capability is the main reliability criterion for power modules. Weak points and fatigue processes are pointed-out. Power cycling tests are described, and are discussed regarding the influence of the test method to the results. Existing models for power cycling lifetime prediction are discussed regarding their usability and limits. Going from Si to SiC will be more challenging for the packaging technology. New technologies promise a large progress. Even the potential for modules with specification of the power cycling up to a junction temperature Tvjmax = 200°C is visible.