Reasearch on simulation and experiment of the extrusion process of high conductivity aluminum alloy for electronic packaging

In this paper, the mould for producing high conductivity aluminum alloy used in electronic packaging has been designed. The three-dimension model is established and extrusion process is simulated by the software DEFORM-3D^TM. The paper researches the distribution of the stress and strain under different extrusion velocities and temperature. The numerical simulation results show that the optimum temperature for extrusion is 480°C and the best extrusion velocity is 350mm/s. An extrusion experiment is performed and anticipate results are got compared with the simulation results. At last, the reasons of some particular defects occurred in the actual productions are analyzed.