Non-destructive testing for defects in electronic package based on Infrared Thermography

Defects such as interfacial delaminations degrade the yield rate and reliability of the device. It's important to find and evaluate these defects on time. Infrared Thermography is proved to be a valuable tool for non-destructive testing of materials. In this paper the relationship between the thermal characteristics of the sample surface and the defect feature parameters is investigated using Infrared Thermography; while an approach to quantitatively evaluate the defect is proposed.