Relationship between SSN and EMC in SiP

An investigation of simultaneous switching noise (SSN) and electromagnetic compatibility (EMC) issues in a physical model of a system in package (SiP) is presented in this paper. SSN simulation is conducted in time domain with an extracted package model which contains package components, drivers and terminal resistors. In addition, electromagnetic interference (EMI) from the SiP is observed from far field and near field. Far-field simulation is performed in a simulated microwave anechoic chamber environment and near-field result is obtained by a near-field scan simulation. The simulation results show that by increasing number of drivers in SiP package will directly level up SSN which is acting as a major source of EMI. Therefore, capacitor placement in the SiP package is proposed for the purpose of SSN suppression and EMI reduction.