Effect of Fe addition to Sn-3Ag-0.5Cu solder on interfacial reactions during aging

The growth kinetics and morphology of the interfacial intermetallic compound (IMC) Cu
₆
Sn
₅
between Sn-3Ag-0.5Cu-xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate during aging were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C and then aged at 150°C. The Fe element tended to suppress the growth of the Cu
₃
Sn layer during solid-state aging. However, the total thickness of IMCs (Cu
₆
Sn
₅
+ Cu
₃
Sn) for the composite solders with Fe particles was similar to that for SnAgCu without Fe particles.