Modeling of crosstalk delay and noise in single-walled carbon nanotube bundle interconnects

In the proposed work, crosstalk effects are investigated in two identically coupled SWCNT bundle interconnects at 21 nm and 15 nm technology nodes for intermediate and global interconnects. An ABCD parameter based approach has been used to investigate crosstalk delay and noise in both sparse and dense SWCNT bundle interconnect system. The simulation results show that the proposed model is not only ~100% accurate but also almost 6 times faster than SPICE. The worst case crosstalk induced delay and peak crosstalk noise voltages for SWCNT bundle interconnects are compared to those of conventional copper (Cu) interconnects at the intermediate as well as global level interconnects. Simulation results also confirm that dense SWCNTs are always ahead of sparse SWCNTs with respect to performance advantage numbers over copper for every levels of interconnects and irrespective of technology nodes. As far as the worst case peak crosstalk noise is concerned, there is a critical length after which the performance of the dense SWCNT bundles is better than that of its sparse counterpart. Simulation results also prove that dense SWCNT bundled interconnect is a potential alternative to Copper interconnects in future nanoscale integrated circuits with respect to performance as well as signal integrity issues.