Nano sized silver for electronic packaging

Production of modern microelectronic devices needs advanced materials and packaging technologies oriented towards the miniaturization and high reliability of the systems. Nano sized silver can be treated as such advanced material and it is used in modern packaging technologies, especially for flexible electronics. The paper presents information about the practical use of silver particles with the size from 4 nanometers in materials for electronic packaging technologies. The special ink containing nanosilver is use for ink-jet printing electrically conductive structures. Such process can be applied for flexible electronics even when structures are printed on temperature sensitive materials. Ink-jet printing may be used for creating the conductive layers of microvias joining both sides of flexible substrates with acceptable level of resistance. Nano sized silver is also used as a component of hybrid filler for electrically and thermally conductive polymer based composites, although the role of nanosilver particles in transport of current or heat in such materials is limited. Nanosilver plays an increasingly important role in joints elements working at high temperatures. The sintering process is done at temperatures significantly below 300 °C and the highest shear strength of joined elements reached several dozens of MPa.