Temperature stabilization of high-power led chips using low-cost passive heat sinks

We present a numerical analysis and experimental measurements of the temperature stabilization of high-power LED chips that we have obtained by employing an aluminium passive heat sink, designed to be used in a compact light bulb configuration. We demonstrate that our system keeps the temperature of the LED chip well-below 60°C yielding long-term operation of the device. Our simulations have been performed for a device of low fabrication costs and which enables an easy installation in public streetlights. The experimental measurements performed in different configurations show a nice agreement with the numerical calculations.