MCM/KGD development roadmap in Japan-EIAJ perspective

The MCM/known good die (KGD) study group in EIAJ surveyed MCM/KGD activities in Japan and the future perspectives for various product areas. Major effort has been focused on chip scale package (CSP) development by every semiconductor manufacturer as an alternative to KGD in Japan, while MCMs with several bare dies are gradually being applied to notebook PCs and personal digital assistants (PDAs). However, bare-die test is still at a low level. High-density printed circuit boards are critical for both CSP and direct flip-chip attachment applications.