E-band receiver and transmitter modules with simply reflow-soldered 3-D WLCSP MMIC's

Newly developed E-band receiver (RX) and transmitter (TX) modules are demonstrated. The reflow-soldering compatibility of the 3-D WLCSP MMIC is made to assemble easily on PCB, which contributes to high mass productivity. The RX module is the first edition, and the TX module is the second edition with an improved Power Amplifier (PA). The PA is designed separately for lower and higher bands; 71 to 76 GHz and 81 to 86 GHz. For the TXs and RXs, the same Tripler and Mixer are employed, both of which perform at full band operation. The RX performances were measured with a conversion gain of 12 ± 1.5 dB and a noise figure of 5.5 ± 0.5 dB. The TX performances were measured with a conversion gain of 29 dB and a saturated output power level of 21 dBm. The WLCSP MMIC technology also provides simple reflow-soldering assembly and cost-effective production.