On-chip integrated antennas on ultra-thin and on high-impedance Si substrate

On-chip integrated antennas show promising results for emergent applications like wireless chip-to-chip communications, wireless sensors, telemetry, etc. The radiation efficiency of such antennas is restrained by the high dielectric losses at microwave frequencies in the silicone substrate. Two ways to increase integrated antenna efficiency are to use either high-impedance or very thin silicon substrate. This paper presents the prototyping of antennas on ultra-thin substrate and compares the results with high-impedance based prototypes, presented in earlier publications.