A numerical comparison of the Maxwell-equations with the transmission line equations with the electromagnetic parameters of conducting structures in chip-packages

The application of two different numerical methods for chip packages are presented: the FDTD solution of the Maxwell's equations in three dimensions with subsequent FFT and the solution of the transmission line equations in the frequency domain. The nonparallel and nonuniform character of the leadframes is taken into account by a three dimensional electrostatic field solution to extract the capacitance and inductance matrices in the case of the transmission line approach. Both methods deliver results for the impedance, the crosstalk and the irradiation of electromagnetic fields. Conclusions are drawn as to the applicability of both approaches on chip packages by comparison of results.