Investigation of Delphi compact thermal model style for modeling surface-mounted Soft Magnetic Composite inductor

Recent works on System-In-Package component pointed out that its in-package inductor is the hottest part. It occurs that thermal stresses due to joule heating and magnetic losses can be damaging. The present study focuses on low profile, surface-mounted, Soft Magnetic Composite inductors to define their thermal behaviour and then to propose a guideline to create pertinent models.