Shear Ram Speed Analysis for Gold Wire Bond Shear Test

Wire bonding are utilized as 1st level interconnection in all electronic devices. The reliability of the bonded wires are assessed by wire bond shear test. In this paper the evaluation of the stress and strain response of the gold ball bond during wire bond shear test using finite element analysis is presented. A 3D non-linear finite element model was developed for the simulation. The effects of the shear ram speed on the stress and strain response of the gold ball bond were investigated. A preliminary investigation confirms that shear ram speed has a significant effect on the von mises stress and equivalent strain response of the gold ball bond during wire bond shear test.