Hybrid VXI/PXI/LXI test system using (MIPSS) IEEE-P1693 standard

The users of today's test systems are seeking integration solutions to marry multiple test standards (VXI/ PXI/LXI) into a common chassis. This paper will describe how a hybrid implementation of the IEEE-P1693 Modular Interconnect Packaging for Scalable Systems (MIPSS) draft standard can accomplish that and provide benefits of less cost, smaller footprint and be transparent to what test interface you would apply. The (MIPSS) draft standard specifies a packaging design that is a plug&play, scalable, and merges multi-standards in a VXI chassis footprint, applying PXI/M-Modules as mezzanine cards mounted to VXI Carrier Modules. A VXI plug-in power module is defined that can provide power to system instruments, fixture components and unit-under-test (UUT) requirements. Interconnecting the specified instrument front-panel I/O to a pluggable test interface of your choice would permit users to mechanically interchange different test interfaces quickly without implication of cabling. The modular plug&play scalable specification with direct coupled interconnect allows the integrator and user to quickly assemble (reconfigure, upgrade, or replace the module within the ATS.