D-band grid-array antenna integrated in the lid of a surface-mountable chip-package

A packaging solution for single-chip millimeter-wave transceivers is presented. It integrates an antenna into the lid of the chip package. Multi-layer organic materials are used as antenna substrate. A prototype demonstrates the feasibility of the packaging process and the antenna performance. It consists of three parts: A package base; a MMIC dummy that allows measuring the antenna including the flip chip interconnect; and a 122-GHz grid array antenna. The complete antenna-in-package prototype is measured using a probe based measurement system.