Volume production technologies for passive and active components embedded PWB

With the popularization of multi-functional portable devices represented by smart phone and tablet computer, the demands for miniaturized, high-performance, and cost-effective PWB have been increasing. In a few years, several types of components embedding into organic substrate (PWB) have been proposed. However, with respect to “volume production technologies”, it has not expanded so far because of concern about new technology, lack of technical support for both equipment and material, skepticism about success example and long term reliability evaluation data, which are all directly or indirectly related to overall cost. This paper focuses on “reliable and cost effective volume production technology” by the combination of B²it™, which stands for Buried Bump technology, and commercialized surface mounting technology with solder joint. In the later section, we will discuss the applied production process, proven introduction examples, and electrical performance. Finally, represent our perception about the future perspective for developing components embedded PCB.