Cavity packages for volume MEMS applications

This article consists of a collection of slides from the author's conference presentation. Some of the specific areas/topics discussed include: The MEMS market; What is a Cavity Package?; High volume low cost cavity package concept; LGA-FL (Formed Lid cavity packages); LGA-MC (Molded Cavity packages); LGA-ML (Molded Lid cavity packages); Design Guidelines; Materials and considerations; Process Flow and considerations; Cavity Package Modeling; and Cavity Package Reliability.