Fast curing, low exotherm epoxy potting and encapsulating systems

Epoxy resins, widely used as insulators in electrical and electronics applications, offer great versatility in properties and cures. These resins can be cured at ambient temperature or elevated temperatures, depending upon choice of curing agents. Also, under certain cure conditions, epoxy resins provide unusually low shrinkage and exceptional dimensional stability. A major advantage of epoxy resins in electrical and electronics applications is their excellent electrical insulating characteristics combined with excellent chemical resistance over a wide variety of operating conditions and environments. As a result, epoxy resins are an obvious choice as potting and encapsulating materials for applications designed to protect sensitive components. This paper reports the development of a two-part epoxy that features a fast-cure and low exotherm.