Effects of Ni/Ag coating on the wettability of Sn-3Ag-0.5Cu alloy on Cu substrates at different temperatures

With the development of high density interconnection and fine pitch technology, good wettability effectively guarantee the reliability of solder joins. Hence, it is essential to carry out researches on wetting behavior between molten solders and metal substrates. The effect of Ni, Ag coating and temperature on wetting behaviors of Sn-3Ag-0.5Cu solder on Cu substrate after reflowing at 523 K, 553 K and 583 K were studied in this paper.