A new low profile coldweld package

During the past 10 years market pressures have pushed the industry to smaller packaging for precision SC-cut resonators. Meanwhile, improvements in the aging performance and electrical characteristics are demanded. In order to meet this demand, Piezo developed a new low profile quartz crystal resonator package. The package is the next step in the evolution of a surface mount package which was introduced by Piezo 15 years ago. The new low profile package, LPP, is a plug in replacement for the HC-37/U package developed by Bell Laboratories in the 1960's. The Piezo package has a maximum sealed height of 4.7 mm (0.185 inches) and a flange diameter of 15.5 mm (0.610 inches) maximum. Finite element techniques are used to model the thermal characteristics of the new package and the results are compared with the HC-37/u. Warm-up data is provided as a means of model verification. The mounting resonances of the package are also modeled using FEA and the results are compared with measured resonators. Since hermeticity is an important factor of a precision resonator, it is examined and compared with the HC-37/u package. In addition the aging and the acceleration sensitivity characteristics of resonators manufactured in the new package are presented and the results are compared to similar resonators sealed in HC-37/u packages.