Thermal modeling and analysis of a power device heat sinks

This paper presents a study about thermal behavior of heat sink — power device assembly. The power device (power transistor, triac, thyristor etc) and the heat sink were modeled in SolidWorks. These models have been used in simulations. We take into consideration different power devices packages, different heat sinks and different thermally conductive pastes. A thermal analysis has been performed by position of heat sink on PCB. In our study, we have taken into consideration the influence of the holes from heat sink in heat dissipations. The results of simulations and experimental measurements realized with a temperature data logger are presented in the paper.