Several methods to debug complex ICs manufactured by submicron process

As Integrated Circuit (IC) design becomes hugely complex and processes approach the deep submicron regime, it is becoming more difficult to debug an IC. In particular, probing a sub-half-micron conductor with a mechanical probing station is not easy. The author describes an integrated debug system (including an E-beam prober, focused ion beam technology, a mechanical probing system, reactive ion etching and mask engineering) which can solve this problem quickly.