Stress analysis of silicon wafer based photovoltaic modules in operation

One cause of failure in PV modules is delamination in the interfaces. After lamination, when layers of PV materials are bonded together at about 145 °C and subsequently cooled down, residual stresses are induced due to the mismatch in coefficients of thermal expansion (CTE). When the PV laminate is subsequently framed and exposed to sunlight, the temperature distribution induced in the module will redistribute the residual stresses. The main objective of this paper is to employ finite element analysis to determine the stress distribution induced in the PV module during operation. Differences in stresses developed in modules with float glass covers and those with tempered glass covers were determined.