Low pressure encapsulation of coils, transformers and electronic assemblies with thermosetting liquid molding compound

Advanced liquid molding and encapsulating compound (ALMEC) systems, a family of polymeric hybrid resin molding compounds that allows economical manufacture of electrical and electronic assemblies are discussed. It is demonstrated that they can be successfully used to encapsulate coils and other electrical and electronic devices. Due to their liquid nature, they allow automation of the molding operation. Stress factor comparison between an ALMEC microelectronic formulation and a typical semiconductor epoxy molding compound shows that this ALMEC microelectronic system has a stress factor 2.6 times lower. A cost analysis of the ALMEC coil formulation versus a typical epoxy molding material for coil encapsulation, is prepared. It is shown that a 50% reduction in molding cost is achieved due to reduced labor, material, cycle time, scrap and maintenance costs.