Application specific LED packaging for automotive forward-lighting application and design of whole lamp module

In this study, we first analyse the requirements both in optical and thermal aspects in theory. With the results of theoretical analysis, we design the application specific light emitting diode (LED) packaging (ASLP) with optimized structural parameters and choose appropriate packaging materials. According to this design, several samples are made and tested. The test results show that the LED packaging can provide a light flux of 1100 lm with a sharp cut-off and the chromaticity of packaging can comply with ECE regulations. In addition, the thermal resistance of packaging can be less than 1.3K/W when equivalent heat transfer coefficient of cooling system is about 5000 W/(m²·K). Secondly, based on the test results, we design a supporting optical system with a novel freeform multi-reflector, an effective cooling system and even a whole headlamp module including low-beam and high-beam functions. Finally, we test the performances of the headlamp, and the test results in simulation can fully comply with ECE and GB regulations.