On the temperature dependence of critical moisture concentration on delamination initiation in microelectronic devices

At a given soldering temperature, Ts the delamination initiation between die surface and molding compound of a P-MQFP80 plastic package is determined only by the critical moisture concentration, C_crit at this interface. In this work, the temperature dependence of critical moisture concentration C_crit on delaminaton initiation was investigated. C_crit was found to decrease with increasing soldering temperature.