Antenna-in-package using PCB and IPD technologies for 60 GHz applications

In this paper, we present several antennas for 60 GHz low-cost packaged modules. These antennas are fabricated using a PCB substrate and the IPD™ technology. In the first part, an antenna is etched on the Taclamplus substrate from Taconic and shows very promising performances. In the second part, a microstrip line on this substrate is directly coupled to an upper patch antenna fabricated in the IPD™ technology from ST Microelectronics. The purpose is to increase the matching bandwidth and still address a low-cost antenna-in-package solution.