FE-simulation of inductively excited lock-in thermography for electronic interconnections

In this paper the non-destructive evaluation method of inductively excited thermography (InduLIT) is investigated utilizing a FE-model. The whole process of InduLIT is simulated. The model is designed as a framework for the fast optimization of the excitation geometry and electrical parameters depending on the sample type. A first embodiment with a novel flexible grid shaped coil and TSVs as samples is presented. For this coil-sample-combination different excitation parameters are optimized. Experimental results of InduLIT on PCB vias match with the simulation in principle.