Design analysis and optimization of metal core BGAs for warpage

The increasing demands for electronic package miniaturization and better thermal management have prompted the design of thermally enhanced Ball Grid Arrays (BGAs). The ball grid array technology having the advantages of being lighter, denser, less expensive, simpler for structural design and easier to align for soldering, has been widely used in various industries. The metal core BGAs are gaining acceptance in the market for its excellent thermal conductivities. They have attractive features of better thermal performance with small footprint, which cannot be achieved with conventional BAG packages [1].