Below-IC post-CMOS integration of thick MEMS on a thin-SOI platform using embedded interconnects

This paper describes a new post-CMOS technology for co-integrating thick (>; 50 μm) high aspect ratio MEMS beneath a thin-SOI (1.5 μm) CMOS platform, in the low resistivity SOI-handle wafer. MEMS postprocessing requires just one photomask step. The low resistance (~ 40 Ω) electrical interconnection between CMOS and MEMS is realized using vertically embedded polysilicon interconnects, formed during standard CMOS processing. Electrical isolation achieved using isolation trenches shows a small leakage current (<; 10
^-12
A) and a typical isolation resistance better than 10
¹²
Ω. Measurements indicate that backside micromachining adjacently-beneath integrated transistors does not affect their characteristics. This 3D integration technology can be applied for fabricating a variety of MEMS devices like capacitive inertial sensors and electrostatic actuators requiring thick, high aspect ratio microstructures with high density electrical interconnection.