Advanced multichip module packaging of microelectromechanical systems

Multichip module (MCM) packaging provides an efficient solution to integration of MEMS with microelectronics. In this paper, new methods of packaging MEMS using two advanced MCM foundry processes are described. A special purpose surface micromachined MEMS packaging test chip was designed and fabricated. The MEMS test die was packaged with CMOS electronics die using the "chips first" General Electric high density interconnect (HDI) technology and the Micro Module System MCM-D process.