Heating capacity analysis of a focused infrared light soldering system

In this work, an optical setup to be used in a focused infrared light soldering system for SMT electronic devices, specifically BGA's, is proposed and analyzed. The measured output parameters were temperature, optical power per incidence area (irradiance), and optical power spatial distribution. The results of this work show that a peak temperature of 271.1°C at the output of the proposed optical setup was obtained, which meets the temperature required for soldering lead free SMT devices, as well as it can have a highly uniform spatial optical power distribution in the soldering area of a 35mm × 35mm BGA.