International microsystems, packaging, assembly and circuits technology conference (IMPACT 2011): P1. Emerging systems packaging technologies

The future challenges for electronic printed circuit boards in automotive applications is further miniaturization, while increasing reliability and reducing costs. Conventional approaches are limited by the latest circuit substrate requirements. Therefore innovative integration concepts and packaging technologies must be evaluated. For this purpose, Continental has managed VISA, a three-year project funded by the Federal Ministry for Education and Research, where electronic components are embedded into PCBs. The so-called i²Board concept was favourized, developed by Schweizer Electronic AG, in which active and/or passive components are mounted and connected onto an electrical substrate material comparable to a flex foil and already can be functionally tested. Afterwards, the assembly is embedded between the inner layers of the PCB and integrated into the PCB's set up. Successful developments were conducted with regard to novel ferrite materials for the embedding of inductivities. Also results for bare dies embedded with new connection technologies, e.g. Cu-pillar-bumping for application for transmission control units are outlined.