High thermal conductive BT resin/silicon nitride composites

In this study, thermally conductive bismaleimide-triazine resin (BT)/silicon nitride (Si₃N₄) composites have been developed. The effect of Si3N4 particles loading on thermal conductivity, glass transition temperature (Tg) and thermal stability of the composites was investigated. It was found that the BT/ Si₃N₄ composites showed increase in thermal conductivity with Si₃N₄ weight fraction. The thermal conductivity of the BT/Si₃N₄ composites was up to 0.94 W/m.K, for a mixture containing 50 wt% of micro Si₃N₄ fillers in the BT resins matrix, which was about 5 times larger than the pure BT resin. Moreover, the BT/Si₃N₄ composites had excellent thermal properties. The Tg values were above 180°C, and thermal decomposition temperatures were over 370°C. The resulting composite with excellent thermal properties can be utilized in high temperature micro-fabrication of heat dissipative components in microelectronic industry.