Development of molding compound for non-Antimony and non-Halogen

Recently, the growing concern of environmental issues are impacting the latest development trends for packaging materials in the semiconductor industry. Therefore, new compounds must not only suit the requirements of various package designs, but also be free of Antimony and Halogen so as not to raise any environmental concerns. In order to achieve the above concept, the following studies have been done against flammability as well as popcorn phenomena: 1. Resin structure analysis. 2. High filler loading by optimizing the particle's size distribution of the filler system. 3. New flame retardant system instead of the current antimony and brominated epoxy combination. Through our studies, it is confirmed that the new flame retardant system and high filler loading are effective for flammability and popcorn phenomena. This new compound has UL-94 V-O antiflammability levels, as well as good performance in reliability, such as popcorn resistance and PCT, etc. In addition, it is confirmed that "High Temperature Storage Life (HTSL)" of this compound is superior to results of compounds utilizing the conventional anti-flammable agent methods of Antimony and Bromine. This technology can be applied to advanced compounds for next generation packages.