Challenges in optoelectronic packaging for high performance WDM networks

It is the purpose of this paper to investigate the challenges that are posed to optoelectronic packaging by WDM. The main thrust of this paper is to review two key components of WDM systems, i.e. the wavelength (de)multiplexer and the WDM laser source, and to compare an integrated optoelectronic approach versus a hybrid or modular approach. This allows us to compare different alternatives and provides insight into the relevant packaging issues as well. The paper starts with a review of network and component trends, an analysis of the WDM market, and a discussion on optoelectronic integration issues. Conclusions are presented at the end.