Moisture and thermal degradation of cyanate-ester-based die attach material

Cyanate-ester-based thermosetting die attach materials, commonly known as Low Temperature Die Attach (LTDA) are the newest innovation in Hermetic Die Attach Technology due to their improved manufacturability, high decomposition temperature and a moisture gettering effect. Although their dispensability and decomposition temperatures are well documented, little information is available on the effects of prolonged exposure to moisture and thermal conditions. A study was therefore conducted to investigate the behaviour of LTDA under thermal and moisture conditioning.