Finite-element based comparative analysis of the thermo-mechanical stresses affecting Si and SiC power switches

This work proposes a comparative study of the thermo-mechanical stress affecting a power switch when implemented with Si and SiC devices, respectively, and exposed to the same operational conditions. It employs advanced finite-element simulation analysis, adopting a dedicated procedure to implement the coupling between the thermal and mechanical domains, which require distinct numerical constructs for sensible results. The technique is applied to derive information about substrate and assembly design needs when making the transition from Si to SiC. As a case-study, a railway traction power load profile is considered.