IGBT driver chip set with advanced digital signal processing

This article describes a new approach to control and drive electronic power switches (such as IGBTs). It uses two ASICs — one on the primary (control) side of the driver and one on the secondary (power) side of it. Both chips exchange control and status signals with each other across the insulation barrier between both sides. The system on the power side digitizes all analog sensor inputs (such as the temperature, DC-link voltage, VCEsat voltage) and transmits this data and other status information to the control side. The other way round, the primary side sends repetitive and differential control signals to the power side. To achieve the required data rates across the insulation barrier, the characteristics of the physical layer are improved. As a result, this new topology greatly improves the protection of the control (primary and client) side in case of a fatal failure of the power side of the system.