Microvia materials: enablers for high density interconnects

As new printed circuit board fabrication processes evolve to build high density suppliers are developing compatible with these processes. This paper will discuss laser and plasma ablatable dielectric materials, available as thin films or coatings on copper. These materials are compatible with conventional PWB techniques, (e.g. layup, lamination, DES) and are amenable to mass blind via formation methodologies. With component densities increasing year after year, the need for dense, cost-effective PWB solutions is immediate. The additional demand for solutions in the same or smaller footprint, at equivalent or lower layer count increases the complexity of the problem. Both of these needs are met when large numbers of small vias are rapidly formed, by laser or plasma ablation techniques, in these dielectrics, connecting outerlayer circuitry to very dense innerlayers, laden with buried vias and fine lines and spaces. These microvia materials play a key role in the industry's ability to produce high density interconnect solutions.