Motorola fast static RAM known good die manufacturing process

The Motorola fast static RAM division has put in place a manufacturing process for both wirebond and flip chip known good die (KGD). The goal was to manufacture KGD with the same quality and reliability as conventionally packaged die. A die level KGD process was developed which allows the reuse of the same equipment, manufacturing and quality infrastructure which is used for conventional package types. The paper discusses infrastructure reuse as it relates to the manufacturing KGD process, manufacturing flow and the process and quality procedures used to insure delivery of cost effective KGD.